Advanced Interconnect Technology - Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.

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Advanced Interconnect Technology	Popularity: Hit: 1067

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	Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
URL:	http://www.ait.com.hk
Title:	Advanced Interconnect Technology (AIT)
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Description:	Business, Electronics and Electrical, Components, Semiconductors - Advanced Interconnect Technology. Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
Specialized in:	Advanced - Die - Detectors

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