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Manufacturer of flexible copper cladded laminate and coverlay including coating, adhesiveless-FCCL, chip on film(COF), photo-imaginable-coverlay (PIC), chip on glass(COG) and tape automatic bonding (TAB) for flexible printed circuit(FPC). Includes product descriptions and photographs of flexible circuit applications.
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| URL: |
http://www.taiflex.com.tw/
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| Title: |
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| Description: |
Business, Electronics and Electrical, Production Equipment and Materials, Materials and Supplies - Taiflex Scientific Co. Ltd.. Manufacturer of flexible copper cladded laminate and coverlay including coating, adhesiveless-FCCL, chip on film(COF), photo-imaginable-coverlay (PIC), chip on glass(COG) and tape automatic bonding (TAB) for flexible printed circuit(FPC). |
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