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           28 April, 2024
 
    
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Summit Design

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Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling. Includes product descriptions and industry news.
URL: http://www.summit-design.com/
Title: The EDA Technology Leader - Mentor Graphics
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Description: Science, Technology, Electronics, CAD - Summit Design. Develops and markets a software package, CLIP a silicon validated yield enhancement solutions for semiconductor CMP process through full-chip simulation, density calculation and dummy filling.
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