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           28 April, 2024
 
    
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Fraunhofer Institute for Reliability and Microintegration

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The Fraunhofer IZM is one of the leading institutes for product-focused development of advanced packaging technologies for microelectronics and microsystems worldwide.
URL: http://www.izm.fhg.de/
Title: Fraunhofer IZM Assembly and Packaging Technologies for Microsystems
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Description: Science, Technology, Electronics, Research Centers - Fraunhofer Institute for Reliability and Microintegration. The Fraunhofer IZM is one of the leading institutes for product-focused development of advanced packaging technologies for microelectronics and microsystems worldwide.
Specialized in: Microelectronics - Design - Simulation - High Density Interconnect - Chip - Reliability - Failure Analysis - Environmental Engineering - Composites

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