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Details: |
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Development and manufacture of materials used in the manufacturing of BGA, CSP, and flip chip semiconductor packages.
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| URL: |
http://www.cooksonsemi.com/
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| Title: |
Cookson Electronics Semiconductor Products |
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| Description: |
We are committed to providing the global semiconductor packaging manufacturers with innovative, high performance materials. Our products enable our valued customers to meet the evolving and demanding needs of the industry. |
| Specialized in: |
Solder Paste
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Sealant
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Die Attach
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